Exhibition
Renxin Zhiyuan (Hangzhou) Semiconductor Technology Co., Ltd.
Booth No.:D56
Intelligent Connectivity and Future Mobility

Website:www.r-semi.com
Email:marketing@r-semi.com
About Us:
Rsemi was established in February 2022. The company focus on the design and sales of ICs for automotive industry. The latest product is the high-speed in-vehicle SerDes chip, which is primarily utilized for high-speed transmission of vehicle video image signals over long distances with low latency, from sensors (cameras/radar) to the main SOC chip of the intelligent driving domain controller, and from the main SOC chip of the cockpit domain controller to the display screen. R-LinC 16Gbps Camera series products have been mass-produced in June 2024, and the 32Gbps Display products have been successfully lit up after the return of the chip in July 2025. So far, the company has completed the development of the first generation of automotive Serdes products and gradually build a multi-scenario product portfolio, ranging from high to low data rates, and applications spanning from cameras to displays, as well as from ADAS (Advanced Driver Assistance Systems) to in-cabin systems.With the debut of our first product in localization projects with GAC and multiple OEMs, Renxin Technology will continue to deeply engage in product research and development, expand our product line layout, and aspire to become a pioneer in domestic automotive chips, contributing our chip strength to the vigorous development of China's automotive industry!
Products
R-LinC: High-speed in-vehicle SerDes Chip