As a key player of automotive electronics and smart chips in Tsinghua Unigroup, Tongxin Microelectronics Co., Ltd. (TMC TONGXIN MICRO) was founded in 2001 by the R&D team of the national ID card chip project from the Institute of Microelectronics of Tsinghua University. TMC TONGXIN MICRO has undertaken several significant national industrial projects, including the second-generation ID chip, the e-ticket system for the 2008 Beijing Olympic Games, dual-interface financial chips with high capacity & security level, and automotive-grade MCUs. It specializes in the fields of automotive electronics and security chips, with a cumulative shipment exceeding 27 billion chips, providing products and services to over twenty countries and regions across Asia, Europe, the Americas, and Africa. With more than 20 years of continuous innovation and breakthroughs, we have accumulated industry-leading chip R&D technologies and wafer testing capabilities, as evidenced by awards and certifications such as the First Prize of National Science and Technology Progress Award, CC EAL6+, GSMA SAS-UP, AEC-Q100 Grade1 and ISO 26262 ASIL D. We have become an industry-leading provider of chips and solutions.