Exhibition
Rsemi Semiconductor Technology (Hangzhou)Co.,Ltd.
Booth No.:C310
Intelligent Connectivity and Future Mobility

Website:www.r-semi.com
Email:marketing@r-semi.com
About Us:
Resmi was established in February 2022. The company is focusing on high-speed interconnect chip design. The first product R-LinC, mass-produced in Q2 2024, is designed for long-distance, low-latency, high-datarate video transmission from sensors like cameras and radars to intelligent driving domain controllers, as well as from cockpit domain controllers to displays. With data rates ranging from 1.6 Gbps to 32 Gbps, R-LinC supports application scenarios in both intelligent driving and cockpit domain, providing full-stack video transmission solutions for intelligent vehicles. The product has been applied in nearly 50 mass-produced vehicle models. Based on leading high-speed interconnect technologies and proven commercialization experience, Rsemi is expanding its business into ultra-high-speed communication applications such as AI data centers, supporting rapid growth of the intelligent vehicles and HPC(high-performance computing) fields.